The localization of automobile chips is of positive significance to ensure the safety of China's automobile Supply chain security and the development of the industry. In order to better promote the "car core linkage", on June 19, a delegation led by Bao Siji of SAIC Motor, Wu Dawei of SAIC Research and Development Institute, Xu Xiufa and Liu Linfa of the Integrated Circuit Association, Wang Ying of the Traffic Electronics Industry Association, Zhang Xuetong, Zhou Duoduo, Ye Peng of the Bank of China Shanghai Branch visited Shanghai Hangxin for investigation and research, Relevant personnel in charge of various departments of Aircore attended the reception.

Collaborative and Progressive Discussion on the Development of the Automotive Industry

The General Manager of Shanghai Hangxin gave a detailed introduction to the company's development history and strategic plan. The R&D and market leaders of Hangxin reported on the company's technological breakthroughs in the field of automotive chips, as well as examples of in car solutions and the supply chain situation of mainstream vehicle manufacturers. After listening to the overall report of our company, the research team gave full recognition and recognized the product innovation ability and quality management strength of Hangxin in the field of automotive electronics.

At the meeting, Aviation Core and SAIC leaders focused on how to ensure the safety of the automobile Supply chain security; How to accelerate the implementation of domestic automotive chip applications; The development trend of intelligent vehicles and the direction of iterative development of automotive chips were discussed and discussed.

SAIC leaders expressed that through this comprehensive exchange, they have gained a deeper understanding of the innovative products of domestic chip companies. The encryption chips of Avionics can effectively ensure the security of on-board data, and the automotive MCU covers multiple scenarios of vehicle front and rear installation, providing new ideas and technical support for the future functional and safety upgrades of intelligent vehicles. At the same time, it also deepens the multi party linkage and bidirectional empowerment of upstream and downstream enterprises in the automotive industry chain, enabling the application demand of downstream automobiles to drive the industrial ecology of upstream chip enterprises' research and development and manufacturing, and laying a foundation for further deepening cooperation. I look forward to making contributions to the localization of automotive chips and working together to promote the process of automotive chip localization through this exchange.

Figure | Aircore introduces automotive products to the research team

At the meeting, Mr. Xu Xiufa, Senior Advisor of the Integrated Circuit Industry Association, stated that with the transformation of the automotive industry, the trend of intelligence and networking has brought new demands to the automotive industry. The new demands have brought new industry opportunities for domestic chip companies to enter the automotive industry.

Regarding how to address the numerous challenges faced by domestic chip substitution in automobiles, the Integrated Circuit Association hopes to lead whole vehicle enterprises into more chip enterprises and create more cooperation opportunities for the upstream and downstream of the industrial chain. Close integration between chip companies and vehicle companies, enabling chip companies to deeply understand the needs of vehicle companies and improve chip performance; Whole vehicle enterprises support the research and development of domestic automotive chips and jointly overcome technical barriers; The government, through policy guidance and industry support, jointly assists in the ecological construction of the domestic automotive chip industry, thereby enabling the Chinese automotive industry to continue to grow in the fierce market competition.

Write at the end

Since its establishment in 2008, Shanghai Hangxin has accumulated 15 years of profound technology in the field of integrated circuit design. In order to achieve comprehensive coverage of multiple scenarios and products in vehicles, Hangxin continuously optimizes its product layout and gradually builds a serialized automotive electronic product ecosystem.

At present, AVIC's safety chips and automotive MCUs have entered the automotive market, covering various applications of in vehicle front and rear loading, continuously breaking through the bottleneck of domestic chip manufacturers in the field of automotive standard chips, and firmly grasping the new opportunities of "lane changing overtaking" brought by industrial transformation trends for chip localization substitution.